| TYPE | DESCRIPTION |
| Mfr | Xilinx (AMD) |
| Series | Zynq®-7000 |
| Package | Tray |
| Product Status | ACTIVE |
| Package / Case | 676-BBGA, FCBGA |
| Speed | 800MHz |
| RAM Size | 256KB |
| Number of I/O | 130 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Architecture | MCU, FPGA |
Long term acquisition of IC chips, diodes, electronic materials, factory inventory, agent inventory, factory obsolete materials, professional team to calculate BOM list, and package total orders. Delivery is available both domestically and internationally
